Memory Connectors

Memory connectors are engineered with precise contact geometries and advanced materials that minimize signal attenuation and reflections, ensuring accurate data transfer. Features such as impedance control, low-contact resistance, and high-frequency grounding prevent electromagnetic interference (EMI) and crosstalk, maintaining signal fidelity. For systems operating at speeds beyond 10Gbps, memory connectors must adhere to stringent industry standards, such as PCIe Gen 4/5 or DDR5 specifications, which demand rigorous testing for signal integrity to avoid data corruption. 

Material Options

Brass, Stainless Steel, Copper, Gold or Palladium Plating

Cable Diameter Range

0.5 mm to 5.0 mm

Temperature Range

-40°C to +125°C

Load Capacity

10A to 40A, depending on connector type

Vibration Resistance

Up to 50 g (depending on mounting type and application)

Product Description

These connectors are designed with robust materials, such as high-strength plastics and metals, and precise plating to prevent wear and degradation. The contact surfaces are often gold or palladium-plated, ensuring low insertion force and high durability over many cycles (up to 10,000 insertions). Additionally, connectors are often equipped with latching mechanisms or other securing features to ensure a stable, low-resistance connection over time, reducing the risk of physical failure due to mechanical strain. 

Corrosion Resistance

High resistance, typically with nickel or gold plating

EMI Shielding

Integrated shielding via conductive metal and plating

Mounting Options

Through-hole, Surface Mount, Press-fit, Snap-fit

Compliance Standards

JEDEC, PCIe, RoHS, UL, ISO/IEC 17025

Custom Features

Custom pin configurations, locking mechanisms, color coding

UV Resistance

UV-resistant coatings available for outdoor use

Fire Resistance Rating

UL 94 V-0 or higher

Chemical Resistance

Resistant to oils, acids, and alkalis

Thermal Expansion Tolerance

±10 ppm/°C (depends on material choice)

Dynamic Load Testing

Up to 10,000 cycles of dynamic insertion and extraction

Precision Tolerances

±0.05 mm for contact pin alignment and fitment

Technical Advantages

Memory connectors are engineered with low-contact resistance to reduce energy losses during data transmission. Even small amounts of resistance in high-speed applications can result in significant power losses, ultimately affecting system performance and thermal management. By minimizing resistance, these connectors help in reducing heat generation, enabling better thermal control in tightly packed systems. This efficiency is particularly critical in mobile devices, IoT systems, and data centers with tight thermal constraints and power budgets. 

Modern memory modules, such as those utilizing DDR4, DDR5, and LPDDR4/5 architectures, require connectors supporting multi-lane, high-bandwidth data paths. Memory connectors are designed to accommodate high-density pinouts while maintaining optimal signal integrity. This enables the integration of larger memory modules with higher data rates into compact form factors. For example, connectors that support 288-pin DDR4 or DDR5 configurations provide efficient space utilization while ensuring sufficient lanes for multi-channel data transmission, essential for applications requiring large memory pools and high throughput, such as high-performance computing and real-time processing. 

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Industry Applications

AI & Machine Learning Systems

Facilitates rapid data processing and memory bandwidth for deep learning and neural network computations in high-performance servers. 

Cryptography Hardware

Ensures secure, high-speed memory connections for encryption/decryption processes in secure processors and hardware security modules (HSMs). 

Edge Computing

Supports distributed memory architecture in edge devices, ensuring fast local data processing for IoT and autonomous systems. 

Quantum Computing

Provides reliable memory connections in quantum processors, where low latency and high precision are critical for qubit operations.

Embedded Systems

Ensures high-speed, low-latency memory interfaces in microcontrollers and system-on-chip (SoC) applications in critical embedded devices. 

Video Processing Systems

Enables high-bandwidth memory interconnects for real-time video encoding/decoding and rendering in broadcasting equipment. 

Thermal Management and High-Temperature Performance

Memory connectors are often subjected to varying thermal conditions in environments where they must function across a wide range of temperatures, from industrial settings with high ambient temperatures to low-temperature applications in aerospace. Connectors are made from materials with low thermal expansion coefficients to meet these challenges, ensuring dimensional stability despite temperature fluctuations. 

As memory technologies evolve, so must the connectors that interface with them. The latest generations of memory modules, such as DDR5, HBM2, and GDDR6, require connectors that handle high-frequency data transmission and support the increased power demands and larger pin counts associated with these technologies. Memory connectors must be compatible with industry standards to work across various platforms and systems.

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Check all our Frequently Asked Question

How does Frigate ensure precision in memory connector manufacturing?

Frigate uses advanced CNC machining and high-precision die-casting methods to ensure tight tolerance and dimensional accuracy. Each memory connector is fabricated with precision tooling and undergoes rigorous quality checks to meet exacting specifications, ensuring reliable performance in high-speed applications. 

What types of materials does Frigate use for memory connector production?

Frigate sources high-quality materials, such as stainless steel, brass, and specialized conductive alloys, to ensure durability and electrical performance. Gold or palladium plating is applied for contact surfaces to reduce wear and ensure low contact resistance, optimizing signal integrity and long-term reliability. 

How does Frigate address thermal expansion in memory connectors?

Frigate designs memory connectors with materials that have low thermal expansion coefficients, ensuring dimensional stability under varying temperature conditions. This ensures connectors maintain their mechanical and electrical properties even in systems exposed to extreme temperature fluctuations, such as automotive or aerospace applications. 

How does Frigate ensure memory connectors meet stringent industry standards?

Frigate’s memory connectors are designed and tested to meet a range of industry standards, including JEDEC for DDR memory and PCIe specifications. Every component undergoes comprehensive testing, including high-speed signal integrity, mechanical stress testing, and thermal performance testing, to guarantee compliance and reliability. 

How does Frigate manage EMI and signal interference in memory connectors?

Frigate incorporates advanced shielding techniques and precision grounding in the design of memory connectors to minimize electromagnetic interference (EMI). The connectors are engineered with optimized contact geometries to ensure signal integrity and reduce crosstalk, ensuring consistent high-frequency performance in sensitive systems. 

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LOCATIONS

Global Sales Office

818, Preakness lane, Coppell, Texas, USA – 75019

Registered Office

23, 6th West Street, Balaji Nagar, Kattur,  Pappakuruchi, Tiruchirappalli-620019, Tamil Nadu, India.

Operations Office

9/1, Poonthottam Nagar, Ramanandha Nagar, Saravanampatti, Coimbatore-641035, Tamil Nadu, India. ㅤ

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Memory Connectors

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