BGA Heat Sinks

Wondering how to stop heat from locking up your tiny BGA chips and crashing your devices? Our BGA Heat Sinks, built from aluminum or copper, lift heat off fast to keep your small circuits running smooth. 

Base Material

Aluminum or copper; alloy customization available upon request

Thermal Resistance

0.5°C/W to 3.0°C/W, suited for BGA package efficiency

Heat Dissipation Capacity

2 W to 25 W, designed for low-to-moderate BGA power levels

Dimensions

Width: 10 mm to 70 mm; Height: 5 mm to 25 mm; Depth: 10 mm to 70 mm (customizable to fit BGA layouts)

Weight

0.01 kg to 0.3 kg, based on material and size for BGA integration

Product Description

Heat stuck in BGA packages can halt performance or ruin parts, causing downtime or defects. Our heat sinks fix this with slim shapes, keeping your gear active and safe. 

Fin Design

Pin fins or cross-cut fins (square or cylindrical); fin spacing: 1 mm to 3 mm for compact airflow

Mounting Type

Adhesive tape, push-pin, or clip-on; tailored for BGA PCB attachment

Cooling Method

Passive (natural convection) or active (small fan), depending on BGA load and airflow

Operating Temperature Range

0°C to 85°C, with maximum base temperature rise of 20°C above ambient

Airflow Compatibility

Supports 5 CFM to 50 CFM, effective with case or external airflow

Surface Finish

Anodized aluminum or nickel-plated copper, enhancing durability and heat transfer

Noise Contribution

Silent in passive mode or below 25 dB with active cooling, minimal in BGA systems

Durability

Rated for 60,000+ hours under continuous BGA operation

Environmental Resistance

Resists dust (IP52 rating) and vibration (per IEC 60068-2-6) in electronic environments

Standards Compliance

Conforms to RoHS, UL 94V-0, and IPC-9592 for BGA safety and performance

Thermal Interface Compatibility

Compatible with thermal tape, pads, or grease for secure BGA contact

Technical Advantages

BGA heat sinks stick on with tape or pins, grabbing heat straight from little chips. They set up fast with no complex tools, saving time on busy production lines. 

Fins shaped as pins or squares stay light, fitting tight spots without extra weight. This quick setup keeps your builds simple and ready to go. 

Let's Get Started

Need reliable Heat Sinks for your next project? Get in touch with us today, and we’ll help you find exactly what you need!

Industry Applications

Smartphones

Lifts heat from BGA chips in phones, keeping calls and apps steady all day. 

Routers

Cools network BGAs, running fast internet without drops every hour. 

Wearables

Pulls heat from watch circuits, holding sensors sharp on every step. 

Tablets

Takes heat off tablet BGAs, playing videos clear without stutters daily. 

IoT Hubs

Manages heat in smart home chips, linking devices strong round the clock. 

Drones

Clears heat from flight BGAs, flying smooth and safe every trip. 

Tiny BGA Cooling Without Limits

Dense BGA layouts need steady cooling to avoid overheating and system lags. BGA heat sinks handle 2 W to 25 W, lasting 60,000+ hours with no trouble. 

Overheating in packed chips can spark failures or slow apps, hurting reliability fast. Heat sinks stay small at 10 mm to 70 mm wide, keeping your circuits cool and stable. 

BGA Heat Sinks

Having Doubts? Our FAQ

Check all our Frequently Asked Question

How thin can BGA heat sinks go for my tight board spacing?

BGA heat sinks scale down to 5 mm high with custom cuts, fitting your narrow board gaps. That slim fit keeps heat low without crowding your layout. 

Will custom BGA heat sinks raise my product’s market edge?

We craft BGA heat sinks to your exact size and mount needs, cooling chips fast in any design. That tailored performance lifts your product’s appeal and sales potential. 

Are BGA heat sinks adjustable for my chip’s odd power loads?

BGA heat sinks tweak fin spacing from 1 mm to 3 mm, matching your chip’s unique power draw. So, precise cooling handles uneven loads without overheating risks. 

Is lead time short for ordering custom BGA heat sinks?

We deliver custom BGA heat sinks in 2-4 weeks, tweaking sizes and mounts to your specs fast. Quick shipping keeps your production on track without delays. 

Do BGA heat sinks swap mounts for my changing designs?

BGA heat sinks switch between tape, pins, or clips, adapting to your evolving board setups. Such flexibility cuts redesign time when your plans shift. 

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LOCATIONS

Global Sales Office

818, Preakness lane, Coppell, Texas, USA – 75019

Registered Office

10-A, First Floor, V.V Complex, Prakash Nagar, Thiruverumbur, Trichy-620013, Tamil Nadu, India.

Operations Office

9/1, Poonthottam Nagar, Ramanandha Nagar, Saravanampatti, Coimbatore-641035, Tamil Nadu, India. ㅤ

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BGA Heat Sinks

Need reliable wires and cables for your next project? Get in touch with us today, and we’ll help you find exactly what you need!

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