Electronic Shielding Spline Ring

Electronic Shielding Spline Ring resolves the issue of shielding degradation due to mismatched coefficients of thermal expansion (CTE) between connector components and cable assemblies. When exposed to temperature variations ranging from cryogenic levels to elevated aerospace operating ranges, the contact stress within the spline ring remains stable due to matched alloy CTE and controlled radial preload. This avoids micro-gap formation that would otherwise introduce transient EMI susceptibility during thermal ramp cycles in mission-critical systems. 

Electronic Shielding Spline Ring provides a long-life shielding solution designed for high mating cycle environments such as satellite ground terminals, test interfaces, and reconfigurable modular assemblies. The ring’s contact elements use beryllium copper or C17200 tempers, heat-treated for mechanical resilience and plated with a nickel barrier under gold to resist fretting and corrosion-induced resistance rise. Mechanical compliance is maintained across thousands of connect/disconnect cycles, ensuring that shielding performance does not degrade due to metal fatigue or plating loss.