Precision BGA Reballing Jig

High-Tg substrates and stacked die BGAs experience uneven thermal expansion, which can warp the package or damage internal interconnects. The Precision BGA Reballing Jig is constructed from Al6061-T6 alloy, selected for its high thermal conductivity and controlled CTE. Integrated expansion slots absorb heat-induced stress while maintaining uniform pressure across the package. This reduces die-edge cracking and maintains ball integrity across corner and center I/O zones. 

Material Specification

Aluminum 6061-T6 (standard), Stainless Steel 303/304 (optional); anodized or hardened for wear resistance.

Dimensional Tolerances

Critical Features – ±0.01 mm (BGA pad alignment); Overall Jig – ±0.05 mm.

Flatness/Coplanarity

≤0.02 mm across entire surface (ensures uniform ball placement).

Hole/Aperture Array Dimensions

Pitch – 0.4 mm–1.27 mm (standard BGA/CSP); customizable to match PCB layout.

Hole/Aperture Diameter & Shape

Diameter – ±0.005 mm; Shape – Round/Square (laser-cut or precision-drilled).

Product Description

Vertical distortion during fluxing or stencil alignment often leads to partial ball seating or pad misregistration. The Precision BGA Reballing Jig includes elastomer-buffered contact points that suppress Z-axis float while preserving planar compression. Fixture deflection is kept below 5 μm under thermal load, ensuring all pads engage uniformly during reflow. This design supports high-reliability applications like automotive and aerospace BGA assemblies. 

Surface Finish

Ball Placement Side – Ra ≤0.4 µm (mirror finish); non-reflective matte optional.

Perpendicularity of Holes/Apertures

≤0.01 mm deviation (90° ±0.1° to base plane).

Burr-Free Requirement

Laser-deburred or micro-machined; ISO 13715 compliant (no sharp edges).

Protective Coating/Anodizing

Anodizing – Type II/III (hard coat, 25–50 µm); Plating – Nickel/Teflon (optional).

Certification Standards

ISO 9001:2015; IPC-7351 compliant (optional); RoHS/REACH compliant.

Technical Advantages

Multi-package reballing workflows require jig systems that adapt without losing alignment precision. The Precision BGA Reballing Jig uses zero-clearance dowel pins and vacuum-assist alignment beds for stencil repeatability within ±15 μm. Its modular plate system supports a wide range of package sizes and stencil apertures without affecting seating accuracy. This enables faster changeovers with no compromise on placement tolerances. 

Flux bleed under the stencil can degrade signal transmission and cause latent failures due to ionic contamination. The Precision BGA Reballing Jig incorporates a nano-coated stencil bed that controls flux behavior through hydrophobic micro-texture engineering. A defined micro-clearance boundary layer prevents flux bridging between pads, maintaining electrical cleanliness post-reflow. This is critical for RF, high-speed digital, and analog-sensitive BGA components. 

Let's Get Started

Need reliable Machining for your next project? Get in touch with us today, and we’ll help you find exactly what you need!

Industry Applications

Telecommunication Equipment Repair

Enables precise BGA reballing for high-frequency transceiver modules where pad-to-ball alignment directly affects signal phase stability. 

Military-Grade Electronics Rework

Supports thermal and mechanical integrity during reballing of ruggedized BGA assemblies exposed to extreme shock, vibration, and thermal cycling. 

Aerospace Avionics Maintenance

Ensures micron-level placement repeatability for avionics BGAs in systems where long-term joint reliability under pressurized environments is critical. 

Medical Device Electronics Refurbishment

Used for high-density micro-BGA rework in implantable and diagnostic electronics requiring zero-defect reflow and contamination-controlled processing. 

Automotive ECU and ADAS Module Rework

Facilitates stable reballing of high-I/O BGAs used in engine control units and advanced driver-assistance systems with thermal shock demands. 

Consumer Electronics Service Centers

Maintains alignment accuracy for multi-layer mobile SoCs, preventing interconnect failure during repetitive repair in compact board architectures. 

 

Precision BGA Reballing Jig

Low Yield in Multi-Component Reballing Environments

Reballing multiple components simultaneously often leads to uneven heat transfer and inconsistent rework results. The Precision BGA Reballing Jig supports parallel processing with isolated fixture bays, each with independent height adjustment and thermal buffering. Micrometer-controlled Z-stops ensure each BGA receives uniform pressure and consistent heat exposure. This architecture increases yield in volume repair centers without sacrificing precision or process control. 

In high-throughput reballing environments, repeated thermal cycling and mechanical handling cause stencil plates to warp or clog, especially at sub-0.5 mm apertures. Warped stencils lead to non-uniform paste deposition, incomplete ball seating, and increased cleaning downtime. The Precision BGA Reballing Jig addresses this by incorporating a rigid stencil support frame with stress-relief features that minimize mechanical flex. 

Precision BGA Reballing Jig

Having Doubts? Our FAQ

Check all our Frequently Asked Question

How does Frigate's Precision BGA Reballing Jig ensure consistent stencil alignment over multiple reballing operations?

Frigate’s jig uses dowel-pinned modular plates with ±10 μm repeatability across stencil swaps. Each plate is CNC-machined and optically verified for aperture-to-pad alignment. This eliminates mechanical play and stencil drift during repeated usage. The system guarantees uniform ball deposition even in high-cycle production settings. 

 

What makes Frigate’s jig suitable for reballing components with large thermal mass like CPU and GPU packages?

Frigate integrates high-conductivity aluminum alloy with thermal equalization slots across the jig body. This design ensures even heat distribution across large BGAs without creating hot spots. It maintains component flatness while avoiding solder voids or thermal fatigue. The setup is optimized for hot-air and IR reflow systems. 

 

How does Frigate’s jig help in reducing rework errors during high-speed telecom BGA reballing?

Frigate’s jig uses micron-etched guide features to maintain pad-to-ball alignment within tight tolerance limits. This ensures consistent signal performance at high frequencies. Anti-static inserts and secure clamping reduce handling-induced electrostatic or mechanical failures. It’s especially effective for BGA rework in RF front-end and baseband modules. 

Can Frigate’s Precision BGA Reballing Jig be adapted for multi-size BGA packages in the same workflow?

Yes, Frigate offers interchangeable stencil and seating modules for various package sizes. The system maintains alignment accuracy regardless of the footprint or ball count. Operators can switch between 10×10 mm and 45×45 mm packages without recalibration. This modularity improves throughput in diverse production lines. 

 

How does Frigate’s jig handle board warpage during reballing of fine-pitch components?

Frigate’s jig uses elastomer supports and vacuum hold-downs to maintain planar pressure distribution. This prevents local bending or board lift during fluxing and ball placement. The controlled Z-axis pressure ensures all pads engage the stencil evenly. It’s ideal for reworking thin-core or flex-rigid assemblies. 

 

Get Clarity with Our Manufacturing Insights

We'd love to Manufacture for you!

Submit the form below and our representative will be in touch shortly.

LOCATIONS

Global Sales Office

818, Preakness lane, Coppell, Texas, USA – 75019

Registered Office

10-A, First Floor, V.V Complex, Prakash Nagar, Thiruverumbur, Trichy-620013, Tamil Nadu, India.

Operations Office

9/1, Poonthottam Nagar, Ramanandha Nagar, Saravanampatti, Coimbatore-641035, Tamil Nadu, India. ㅤ

Other Locations

GENERAL ENQUIRIES

Get Quote
Support All File Formats Including - STEP | STP | SLDPRT | STL | DXF | IPT | X_T | X_B | 3DXML | CATPART | PRT | SAT | 3MF | JT files

Precision BGA Reballing Jig

Need reliable Machining for your next project? Get in touch with us today, and we’ll help you find exactly what you need!

Get Latest Price

Get Price Form

Precision BGA Reballing Jig

Need reliable wires and cables for your next project? Get in touch with us today, and we’ll help you find exactly what you need!

Get Latest Price

Get Price Form