CPU Mounting Frame

Name: CPU Mounting Frames & Processor Retainer Assemblies – Frigate
Price: 249.00 USD
Availability: InStock

CPU Mounting Frame is a mechanical retention component designed to ensure precise alignment, controlled compression, and physical stability of processors on PCBs. It addresses socket strain, board flex, and thermal stress issues encountered during CPU installation, operation, and rework cycles. By incorporating precision tolerances and materials engineered for dimensional stability, CPU Mounting Frame becomes essential for maintaining mechanical and electrical reliability in modern computing systems.

Material Specification

Aluminum 6061-T6 (standard), Copper Alloy C11000 (high conductivity), or Stainless Steel 304 (heavy-duty)

Dimensional Tolerances

±0.02 mm (CPU socket area), ±0.05 mm (overall frame dimensions)

Flatness/Coplanarity

≤0.03 mm across CPU contact surface (ensures proper heat sink seating)

Mounting Hole Specs

M3/M4 threaded (±0.01 mm position), countersunk or through-hole options

Surface Finish

Ra ≤0.8 µm (contact surfaces), bead blasted or brushed finish (non-contact)

Product Description

CPU Mounting Frame provides a defined load path to distribute contact force evenly across the CPU’s integrated heat spreader. Uneven pressure during socket engagement can result in localized stress, leading to partial pin contact, impedance mismatches, and intermittent signal degradation. The frame eliminates pressure concentration by enforcing symmetric Z-axis compression, which is critical for maintaining contact integrity in high-speed LGA sockets supporting interfaces such as DDR5 and PCIe Gen5.

Burr-Free Requirement

Fully deburred, smooth edges (ISO 13715 compliant)

Protective Coating

Type III hardcoat anodizing (50-75 µm) or nickel plating

Cleanliness Requirements

Class 100 cleanroom packaged, non-ionic residue (<10 µg/cm²)

Warpage Limits

≤0.05 mm under 5kg load at 85°C operating temperature

Certification Standards

ISO 9001:2015, RoHS/REACH compliant, Intel/AMD socket compatibility

Technical Advantages

CPU Mounting Frame minimizes mechanical deformation of the PCB during processor mounting and heatsink attachment. In multi-layer boards with reduced thickness or high copper densities, board flex can induce layer misregistration, pad lifting, or internal via damage. By applying counteracting forces across a rigid mounting boundary, CPU Mounting Frame stabilizes the substrate, maintains surface planarity, and prevents mechanical damage that may otherwise result from thermal expansion or torque-induced distortion.

CPU Mounting Frame plays a crucial role in maintaining flat, parallel mating surfaces between the CPU and the thermal interface assembly. As CPUs operate at higher thermal design powers (TDPs), any non-uniformity in contact pressure can increase thermal resistance and reduce heat sink efficiency. With machined flatness within ±0.02 mm and calibrated mounting force distribution, CPU Mounting Frame ensures optimal TIM compression and consistent thermal conduction under dynamic temperature profiles.

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Industry Applications

Data Center Server Boards

Used to maintain socket compression and thermal interface uniformity in high-TDP processors deployed on dense multi-socket server boards.

High-Performance Computing (HPC)

Ensures mechanical stability for CPUs with high core counts under continuous thermal cycling in compute-intensive simulation and analytics workloads.

Telecom Baseband Processing Units

Provides socket alignment and vibration resistance in CPU modules deployed in remote radio heads and 5G base station enclosures.

Edge AI Inference Systems

Secures compact CPUs in fanless enclosures, maintaining thermal path reliability and mechanical loading tolerance in rugged environmental conditions.

Industrial Automation Controllers

Stabilizes CPU mounting in real-time control boards exposed to shock, vibration, and fluctuating ambient temperatures during machine operation.

Defense Embedded Systems

Supports thermal and structural requirements of CPUs in mission-critical systems designed for high shock, altitude, and electromagnetic interference conditions.

Supporting Rework and Field Maintenance

CPU Mounting Frame incorporates retention features that allow repeated CPU or heatsink removal without degrading the mechanical integrity of the PCB or socket. Rework cycles, especially in field-serviceable systems, can induce fatigue in standoffs or mounting holes. The frame’s high-modulus material and stable anchoring system enable repeated engagement with controlled torque, preventing micro-creep and preserving socket co-planarity throughout extended service intervals.

CPU Mounting Frame is dimensionally matched to a range of processor socket standards including Intel® LGA1700, LGA4189, AMD® SP5, SP6, and custom embedded BGA configurations. Each frame is machined with tolerance control specific to socket keep-out zones, heatsink clearance envelopes, and mechanical Z-height budgets. This ensures zero interference with neighboring components and maintains alignment within CPU mechanical load limits specified by OEM datasheets.

Having Doubts? Our FAQ

Check all our Frequently Asked Question

How does Frigate ensure co-planarity between the CPU Mounting Frame and socket interface on multi-layer boards?

Frigate machines each CPU Mounting Frame with flatness tolerances within ±0.02 mm to ensure parallel alignment with the socket interface. This reduces any Z-axis tilt that can disturb LGA contact reliability. Frames are aligned using precision dowel holes referenced to the socket center. This keeps surface deflection minimal during thermal and mechanical loading.

What materials does Frigate use for CPU Mounting Frames in high-vibration embedded environments?

Frigate offers CPU Mounting Frames in anodized aluminum and high-strength glass-filled PEEK for superior stiffness and low CTE. These materials perform well in shock-prone environments like defense or automotive boards. The frames retain structural geometry under continuous stress without loosening fasteners. This is essential for vibration-sensitive socket designs like BGA-on-flex assemblies.

Can Frigate design CPU Mounting Frames to support asymmetric heatsink loads?

Yes, Frigate custom-engineers CPU Mounting Frames with variable thickness and reinforced zones to counter asymmetric heatsink weight. This prevents torsional strain on the socket even when cooling modules are offset. Mounting holes can be repositioned to balance uneven load vectors. This keeps package-to-socket pressure distribution within mechanical spec limits.

How does Frigate validate CPU Mounting Frame fit for non-standard socket outlines?

Frigate uses 3D CAD data from the customer to define keep-out zones, mounting hole spacing, and socket stack height. Prototypes are inspected with CMM equipment to verify all mechanical tolerances. Frame outlines are adjusted to clear nearby SMT components without violating layout rules. Each design goes through thermal simulation for assembly stress analysis.

What fastening systems does Frigate support in its CPU Mounting Frame designs for torque-limited applications?

Frigate offers torque-controlled fastener systems including spring-loaded standoffs, pre-calibrated captive screws, and torque-limiting inserts. These features help maintain socket compression without overloading the PCB or warping the CPU lid. The designs comply with manufacturer-recommended compression specs for Intel and AMD processors. Frigate also supports secondary retention features for post-installation stability.

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