Heat Sink Assembly Plate

Name: Cooling Plate Assemblies for Electronics & Thermal Control – Frigate
Price: 249.00 USD
Availability: InStock

Heat Sink Assembly Plate ensures consistent heat distribution across high-density modules by incorporating isotropic thermal conductivity pathways. These plates eliminate localized hotspots caused by uneven loading, maintaining thermal uniformity across all interfaces. By enabling both lateral and vertical thermal conduction, the plate supports stable operation in stacked or multi-layered power assemblies.

Material Specification

Aluminum 6061-T6 (AMS 4025), Copper C110 (ASTM B152), Graphite Composite (ISO 18753)

Dimensional Tolerances

±0.05mm (Critical Features), ±0.1mm (Overall Profile), Thickness: ±0.02mm

Surface Finish Requirement

Ra ≤0.8µm (Mounting Surface), Ra ≤1.6µm (Fin Side), Micro-Arc Oxidation (Optional, Ra ≤0.4µm)

Thermal Conductivity

Al – 150-180 W/m·K, Cu – 380-400 W/m·K, Graphite – 300-500 W/m·K (In-Plane)

Coating/Anodizing

Hard Anodized (Al, MIL-A-8625 Type III), Nickel Plated (Cu, ASTM B733), Anti-Oxidation Coating Aluminum), Skin Depth Optimized for Operating Frequency

Product Description

Heat Sink Assembly Plate is manufactured to achieve tight flatness and surface finish specifications, reducing contact resistance at thermal junctions. With sub-10-micron flatness and sub-0.5 Ra roughness, the plate enhances coupling with thermal interface materials. This precision minimizes air entrapment, improves heat transfer efficiency, and prevents thermal fatigue at bonded surfaces.

Certification Standard

ISO 9001, RoHS/REACH Compliant, IPC-7095 (Thermal Management), UL 94 V-0 (Flammability)

Flatness & Parallelism

Flatness ≤0.05mm/m, Parallelism ≤0.03mm, Perpendicularity ≤0.02°

Mechanical Strength

Tensile Strength ≥240MPa (Al), Fatigue Life – 10⁶ Cycles, Impact Resistance: 10J

Fin Design/Size

Pin Fin (Ø2-5mm), Straight Fin (1-3mm Pitch), Custom CFD-Optimized Patterns

Hardness & Corrosion

Hardness – 60-80 HRB (Al), Salt Spray 1000hrs (ASTM B117), Thermal Cycling (-40°C to +125°C

Technical Advantages

Heat Sink Assembly Plate can be designed with tailored material stacks to match the coefficient of thermal expansion (CTE) of adjacent substrates such as silicon dies or ceramic boards. This compatibility reduces the mechanical stress from thermal cycling, preventing cracking, delamination, or warping during extreme temperature fluctuations.

Heat Sink Assembly Plate with embedded thermal zoning allows selective dissipation of heat from isolated component clusters. Integrated heat pipes, cut-outs, and thermal barriers manage localized heat paths, enabling decoupling of high-power and temperature-sensitive zones within a common structure. This design ensures controlled thermal segregation in complex electronics.

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Industry Applications

Power Electronics Modules

Supports thermal dissipation in IGBT and MOSFET assemblies, maintaining junction temperatures within limits during continuous high-frequency switching operations.

Telecommunication Base Stations

Enables heat removal from densely populated RF amplifier boards operating under high duty cycles in outdoor and thermally constrained enclosures.

Electric Vehicle Inverters

Provides thermal interface for SiC/GaN-based inverter modules, ensuring stable operation under wide temperature ranges and transient thermal spikes.

LED Lighting Arrays

Distributes and dissipates heat from high-power multi-die LED clusters, preventing wavelength shift and lumen degradation over prolonged operation.

Aerospace Avionics Systems

Serves as lightweight thermal spreader in compact avionics enclosures exposed to altitude-induced temperature gradients and limited convection cooling.

Industrial Motor Drives

Transfers heat from gate drivers and power conversion units in variable frequency drives under continuous industrial operation and enclosure sealing.

Weight-Constrained Structural Support

Heat Sink Assembly Plate constructed from aluminum-lithium or graphite composites offers high mechanical stiffness with low mass, crucial for aerospace and mobile systems. The structural design ensures mechanical integrity under vibration and shock loads while supporting the thermal requirements of densely populated circuits without exceeding system weight budgets.

Heat Sink Assembly Plate with high in-plane thermal conductivity spreads heat laterally, supporting devices that require uniform surface temperatures. Use of oriented graphite or carbon fiber layers within the plate improves XY-plane conduction, enabling efficient heat routing toward edge-mounted cooling units or heat exchangers.

Having Doubts? Our FAQ

Check all our Frequently Asked Question

How does Frigate ensure dimensional consistency across large-format Heat Sink Assembly Plates used in power modules?

Frigate uses precision CNC milling and surface grinding to maintain flatness below 10 microns across entire plate areas. Coordinate Measuring Machines (CMM) are used for verifying tolerances on critical zones. Fixture-based setups reduce thermal warping during machining. This process ensures reliable alignment with power module footprints and interface hardware.

Can Frigate integrate heat pipes or vapor chambers into custom Heat Sink Assembly Plate designs?

Yes, Frigate supports embedded thermal solutions such as flattened heat pipes and vapor chambers during plate fabrication. These are thermally bonded into cavities using controlled-pressure brazing or epoxy systems. Design is validated using CFD thermal simulations before production. This allows localized heat extraction from high-power zones in compact layouts.

How does Frigate handle materials with different thermal and mechanical behaviors in a single Heat Sink Assembly Plate?

Frigate uses bonded stack-ups combining dissimilar materials like aluminum, copper-moly composites, and dielectric layers. Finite Element Analysis (FEA) is used to model thermal expansion and mechanical stress. Controlled lamination and diffusion bonding techniques ensure long-term stability. This allows tailoring of thermal paths while preventing delamination or material fatigue.

What surface treatments does Frigate offer for Heat Sink Assembly Plates used in harsh environmental conditions?

Frigate offers anodizing, electroless nickel plating, and ceramic coating for corrosion resistance and electrical isolation. Treatments are selected based on the end-use environment, such as marine, aerospace, or industrial zones. Surface roughness is controlled post-treatment to maintain thermal contact quality. Coatings also serve to reduce galvanic corrosion in multi-metal assemblies.

How does Frigate ensure repeatable mounting during assembly of Heat Sink Assembly Plates in modular systems?

Mounting features such as tapped holes, dowel pin locators, and counterbores are machined with ±0.02 mm precision. Frigate uses jig-based setups during machining and post-inspection to validate positional accuracy. This ensures repeatability across production batches for high-volume modular systems. Stable mechanical alignment enhances thermal contact and reduces mechanical stress during installation.

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10-A, First Floor, V.V Complex, Prakash Nagar, Thiruverumbur, Trichy-620013, Tamil Nadu, India.

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