Engine mounts, chassis parts, and machined components for assembly lines.
Thrust reverser latches, bolt carrier assemblies, and fasteners for aircraft and defense sector.
Connector housings, EMI shielding brackets and lightweight chassis for industrial electronics parts.
Precision housings, actuator frames, and armature linkages for automation systems.
Metal frames, brackets, and assemblies for appliances and home equipment.
Orthopedic implant screws, surgical drill guides and enclosures for sterile environments.
Solar mounting parts, wind turbine brackets, and battery enclosures.
Valve bodies, flange blocks, and downhole drilling components.
Rudders, propellers and corrosion-resistant components for offshore and deck-side systems.
CNC machining delivers micron precision and tight tolerances for complex geometry.
Optimized for mass production, high-volume machining utilizes advanced automation and process control to ensure consistent quality, tight tolerances, and superior cost efficiency at scale.
Designed for precision-driven applications, low-volume machining supports prototype development and limited production runs with high accuracy, rapid iteration, and reduced tooling requirements.
The FPGA Module Cooling Bracket uses rigid anchoring at defined PCB mounting zones to prevent mechanical decoupling or interface fatigue during prolonged exposure to vibration or mechanical shock. This is critical in applications such as avionics, defense electronics, or autonomous platforms where solder joint integrity and TIM (thermal interface material) stability must be preserved over extended thermal and mechanical cycles. The bracket’s material selection considers CTE compatibility with the PCB stack to minimize warping or thermal mismatch-induced stress.
The FPGA Module Cooling Bracket is specifically designed with mechanical clearances to avoid obstructing high-speed I/O interfaces including SERDES lanes, high-density mezzanine connectors, and edge-mounted transceivers. Its geometry is optimized to comply with standard FMC, VITA 57.1, and PCIe zone constraints. This ensures that critical signal integrity paths remain undisturbed, allowing seamless integration of optical transceivers, high-speed ADC/DAC modules, or RF front-end mezzanines in densely routed FPGA designs.
The FPGA Module Cooling Bracket features built-in mechanical compression stops that regulate contact pressure applied to thermal interface materials, enabling precise and repeatable heat transfer characteristics across production units. This eliminates performance variability caused by inconsistent thermal paste applications or uncontrolled pad compression, which is often a major issue in low-volume or manually assembled systems. The bracket supports a range of TIMs with known compliance behavior, ensuring thermal impedance values remain within modeled tolerances.
Need reliable Machining for your next project? Get in touch with us today, and we’ll help you find exactly what you need!
Enables conduction cooling in rugged FPGA modules used in defense-grade electronics conforming to MIL-STD-810 thermal and vibration requirements.
Supports thermal extraction from high-power FPGAs in compact rackmount servers where vertical airflow is restricted or non-existent.
Stabilizes FPGA thermal behavior in edge AI systems exposed to wide ambient temperature shifts and continuous mechanical vibration.
Ensures heat dissipation in FPGA-based controllers with deterministic real-time processing requirements and limited enclosure ventilation.
Maintains junction temperature limits in FPGA logic cores used for signal reconstruction in MRI, CT, and ultrasound devices.
Provides mechanical and thermal compliance for conduction-cooled FPGA systems deployed in vibration-prone, pressurized, or sealed flight hardware.
The FPGA Module Cooling Bracket enables conduction-based thermal transfer in systems with limited or no airflow. It is suitable for sealed enclosures, 1U server platforms, and fanless edge devices. The bracket forms a direct thermal bridge between the FPGA die and the chassis wall or cold plate. Optimized contact surfaces and compliant gap pads ensure stable heat dissipation under changing thermal loads.
The FPGA Module Cooling Bracket is built for fast and repeatable assembly. It includes alignment pins, captive fasteners, and controlled preload on thermal interface materials. The bracket allows easy access to the FPGA module during service without disturbing nearby components. This supports maintainability in modular and high-reliability systems.
Check all our Frequently Asked Question
Frigate uses detailed board-level mechanical drawings and 3D CAD integration to match the bracket footprint with specific FPGA module geometries. Mounting holes, height offsets, and contact zones are adjusted to align with each PCB’s stack-up and component clearances. This ensures the bracket applies uniform pressure without interfering with surrounding devices. Customization is supported through controlled CNC machining and thermal simulation validation.
Frigate’s bracket supports a range of TIMs including thermal gap fillers, graphite pads, and phase change materials. Compression limits are built into the bracket to control pad deformation and maintain consistent contact resistance. TIM selection is based on interface flatness, power density, and operating temperature range. Material datasheets and thermal impedance modeling are reviewed before finalizing the bracket-TIM pairing.
Frigate uses steady-state and transient thermal simulations with detailed power maps from FPGA vendors like Xilinx and Intel. These simulations evaluate junction-to-ambient resistance under real-world loads and enclosure conditions. Physical prototypes are tested with thermocouples and infrared imaging to validate results. The data ensures each bracket design meets target thermal limits across worst-case conditions.
Yes, Frigate provides bracket designs that accommodate board-level shielding cans and conformal coatings without interference. Clearance is maintained between the bracket and coated surfaces to prevent abrasion or grounding faults. Conductive coatings on the bracket can be added for EMI containment if required. All mechanical interfaces are validated for electrical isolation where needed.
Frigate offers tool-less captive screws, threaded standoffs, or spring-loaded fasteners based on the application’s serviceability and mechanical constraints. Each method is torque-limited to maintain proper compression on the thermal interface material. Brackets also include anti-rotation features to prevent loosening under vibration. Mounting solutions are validated through mechanical load simulations and vibration testing.
Submit the form below and our representative will be in touch shortly.
10-A, First Floor, V.V Complex, Prakash Nagar, Thiruverumbur, Trichy-620013, Tamil Nadu, India.
9/1, Poonthottam Nagar, Ramanandha Nagar, Saravanampatti, Coimbatore-641035, Tamil Nadu, India. ㅤ
FRIGATE is a B2B manufacturing company that facilitates New Product Development, contract manufacturing, parallel manufacturing, and more, leveraging its extensive partner networks.
Need reliable Machining for your next project? Get in touch with us today, and we’ll help you find exactly what you need!
Need reliable wires and cables for your next project? Get in touch with us today, and we’ll help you find exactly what you need!