FPGA Module Cooling Bracket

Name: FPGA Heat Management Brackets & Logic Cooling Components – Frigate
Price: 249.00 USD
Availability: InStock

The FPGA Module Cooling Bracket provides a direct conduction path from the heat-generating surface of high-performance FPGA packages, such as BGA-lidded Xilinx or Intel devices, to an external thermal sink or chassis-integrated cold plate. Designed to handle power dissipation levels exceeding 50 W, the bracket incorporates low thermal resistance interfaces with controlled flatness and preload. This enables effective management of junction-to-ambient thermal gradients in systems where airflow is restricted or where passive cooling is required for reliability or noise constraints.

Material Specification

Aluminum 6061-T6 (standard), Copper C11000 (high conductivity), or Aluminum 1050 (for pure thermal transfer)

Dimensional Tolerances

±0.02 mm (FPGA contact area), ±0.01 mm (heat sink mounting surface)

Flatness/Coplanarity

≤0.02 mm across thermal interface surface

Mounting Hole Specs

M2-M4 threaded (±0.01 mm position), countersunk or through-hole with thermal pad relief

Fin Geometry

3-5 mm fin height, 1.5-3 mm spacing (custom patterns available)

Product Description

The FPGA Module Cooling Bracket uses rigid anchoring at defined PCB mounting zones to prevent mechanical decoupling or interface fatigue during prolonged exposure to vibration or mechanical shock. This is critical in applications such as avionics, defense electronics, or autonomous platforms where solder joint integrity and TIM (thermal interface material) stability must be preserved over extended thermal and mechanical cycles. The bracket’s material selection considers CTE compatibility with the PCB stack to minimize warping or thermal mismatch-induced stress.

Surface Finish

Ra ≤0.4 µm (thermal contact surfaces), anodized or bare finish options

Burr-Free Requirement

Fully deburred with radius edges (ISO 13715 compliant)

Protective Coating

Type III hardcoat anodizing (50µm) or nickel plating

Cleanliness Requirements

Class 100 cleanroom packaged, non-ionic residue (<5 µg/cm²)

Certification Standards

ISO 9001:2015, RoHS/REACH compliant, MIL-STD-810G thermal cycling tested

Technical Advantages

The FPGA Module Cooling Bracket is specifically designed with mechanical clearances to avoid obstructing high-speed I/O interfaces including SERDES lanes, high-density mezzanine connectors, and edge-mounted transceivers. Its geometry is optimized to comply with standard FMC, VITA 57.1, and PCIe zone constraints. This ensures that critical signal integrity paths remain undisturbed, allowing seamless integration of optical transceivers, high-speed ADC/DAC modules, or RF front-end mezzanines in densely routed FPGA designs.

The FPGA Module Cooling Bracket features built-in mechanical compression stops that regulate contact pressure applied to thermal interface materials, enabling precise and repeatable heat transfer characteristics across production units. This eliminates performance variability caused by inconsistent thermal paste applications or uncontrolled pad compression, which is often a major issue in low-volume or manually assembled systems. The bracket supports a range of TIMs with known compliance behavior, ensuring thermal impedance values remain within modeled tolerances.

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Industry Applications

Embedded Military Systems

Enables conduction cooling in rugged FPGA modules used in defense-grade electronics conforming to MIL-STD-810 thermal and vibration requirements.

1U High-Density Servers

Supports thermal extraction from high-power FPGAs in compact rackmount servers where vertical airflow is restricted or non-existent.

Autonomous Vehicle Control Units

Stabilizes FPGA thermal behavior in edge AI systems exposed to wide ambient temperature shifts and continuous mechanical vibration.

Industrial Vision and Motion Controllers

Ensures heat dissipation in FPGA-based controllers with deterministic real-time processing requirements and limited enclosure ventilation.

Medical Imaging Equipment

Maintains junction temperature limits in FPGA logic cores used for signal reconstruction in MRI, CT, and ultrasound devices.

Aerospace Avionics Modules

Provides mechanical and thermal compliance for conduction-cooled FPGA systems deployed in vibration-prone, pressurized, or sealed flight hardware.

Conduction Cooling Path for Low-Profile and Fanless Systems

The FPGA Module Cooling Bracket enables conduction-based thermal transfer in systems with limited or no airflow. It is suitable for sealed enclosures, 1U server platforms, and fanless edge devices. The bracket forms a direct thermal bridge between the FPGA die and the chassis wall or cold plate. Optimized contact surfaces and compliant gap pads ensure stable heat dissipation under changing thermal loads.

The FPGA Module Cooling Bracket is built for fast and repeatable assembly. It includes alignment pins, captive fasteners, and controlled preload on thermal interface materials. The bracket allows easy access to the FPGA module during service without disturbing nearby components. This supports maintainability in modular and high-reliability systems.

Having Doubts? Our FAQ

Check all our Frequently Asked Question

How does Frigate ensure compatibility of the FPGA Module Cooling Bracket with custom or non-standard board layouts?

Frigate uses detailed board-level mechanical drawings and 3D CAD integration to match the bracket footprint with specific FPGA module geometries. Mounting holes, height offsets, and contact zones are adjusted to align with each PCB’s stack-up and component clearances. This ensures the bracket applies uniform pressure without interfering with surrounding devices. Customization is supported through controlled CNC machining and thermal simulation validation.

What thermal interface materials are supported by Frigate's FPGA Module Cooling Bracket design?

Frigate’s bracket supports a range of TIMs including thermal gap fillers, graphite pads, and phase change materials. Compression limits are built into the bracket to control pad deformation and maintain consistent contact resistance. TIM selection is based on interface flatness, power density, and operating temperature range. Material datasheets and thermal impedance modeling are reviewed before finalizing the bracket-TIM pairing.

How does Frigate verify thermal performance before FPGA Module Cooling Bracket production?

Frigate uses steady-state and transient thermal simulations with detailed power maps from FPGA vendors like Xilinx and Intel. These simulations evaluate junction-to-ambient resistance under real-world loads and enclosure conditions. Physical prototypes are tested with thermocouples and infrared imaging to validate results. The data ensures each bracket design meets target thermal limits across worst-case conditions.

Can Frigate's FPGA Module Cooling Bracket be used in systems requiring EMI shielding or conformal coating?

Yes, Frigate provides bracket designs that accommodate board-level shielding cans and conformal coatings without interference. Clearance is maintained between the bracket and coated surfaces to prevent abrasion or grounding faults. Conductive coatings on the bracket can be added for EMI containment if required. All mechanical interfaces are validated for electrical isolation where needed.

What fastening methods does Frigate use for ensuring secure and repeatable installation of the bracket?

Frigate offers tool-less captive screws, threaded standoffs, or spring-loaded fasteners based on the application’s serviceability and mechanical constraints. Each method is torque-limited to maintain proper compression on the thermal interface material. Brackets also include anti-rotation features to prevent loosening under vibration. Mounting solutions are validated through mechanical load simulations and vibration testing.

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10-A, First Floor, V.V Complex, Prakash Nagar, Thiruverumbur, Trichy-620013, Tamil Nadu, India.

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