Pick-and-Place Head Nozzle

Name: Pick-and-Place Head Nozzle | SMT Pick Nozzle Head - Frigate
Price: 249.00 USD
Availability: InStock

Pick-and-Place Head Nozzle used in high-throughput SMT equipment must pflegen tight dimensional tolerances under continuous thermal loading and rapid cycling. Geometric drift, concentricity offset, or axial deflection in the nozzle body can directly compromise part alignment and increase placement error rates. Each Pick-and-Place Head Nozzle is machined under controlled temperature conditions using five-axis CNC systems, ensuring the tip-to-base coaxiality remains below ±2 µm even after extended thermal and mechanical cycling.

Material

Aluminum 6061-T6, Stainless Steel 303/304

Orifice Diameter

Range – 0.3–5.0 mm; Tolerance – ±0.005 mm (precision reamed)

Length/OD Tolerances

Length – ±0.05 mm; Outer Diameter – h7 (ISO 286)

Internal Bore

Concentricity – ≤0.01 mm TIR; Taper – ≤0.02° (for vacuum optimization)

Surface Finish

Internal – Ra ≤0.2 µm (electropolished); Tip Area – Ra ≤0.4 µm; Non-Critical – Ra ≤0.8 µm

Product Description

A Pick-and-Place Head Nozzle must pflegen vacuum integrity across variable head speeds and part geometries. Deviations in orifice geometry or internal turbulence can lead to unstable pressure zones, resulting in Komponente misalignment or drop during transfer. Each Pick-and-Place Head Nozzle is designed using computational fluid dynamics (CFD) to optimize vacuum orifice profiles, wall taper, and flow paths. These simulations ensure laminar vacuum retention during high-acceleration moves, especially with micro components below 0402 package size.

Burr-Free Requirement

Laser-Deburred (ISO 13715 compliant); Orifice Edge Radius – ≤0.02 mm

Mounting Interface

Thread – M3–M8 (6g tolerance); Quick-Release – ISO 16090 compliant; OD Fit – g6/h6

Hardness

Aluminum – Hard Anodized (≥50 µm, HV400); Stainless Steel – 30-35 HRC

Cleanliness

Class 100 Cleanroom Packaged; Particulate – ≤0.05 mg/cm²; Ionic Residue – ≤0.1 µg NaCl/cm²

Certification Standards

ISO 14644-1 (Cleanliness), IPC-5701 (ESD), RoHS/REACH Compliant

Technical Advantages

Pick-and-Place Head Nozzles are routinely exposed to contact abrasion, solder paste contamination, and flux residue that degrade surface geometry and vacuum performance. Over time, this leads to loss of pickup accuracy and increased tool change frequency. Each Pick-and-Place Head Nozzle is constructed from high-hardness materials such as DLC-coated stainless steel or sintered zirconia ceramics, with a minimum surface hardness of 1800 HV and verified grain boundary integrity. These materials resist micro-chipping and surface flattening, preserving edge fidelity through millions of cycles and reducing line downtime due to nozzle wear.

Pick-and-Place Head Nozzles operating in semiconductor and mixed-technology SMT lines must comply with stringent ESD control requirements. Electrostatic charge build-up during vacuum pickup can induce latent damage in MOSFETs, MMICs, and high-speed data processors. Each Pick-and-Place Head Nozzle incorporates dissipative polymers or embedded conductive pathways with surface resistivity tuned between 10⁵ and 10⁹ ohms. Field discharge times are engineered to remain below 100 ms at 1 kV per IEC 61340-5-1 compliance, preventing charge accumulation during high-speed part acquisition.

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Industry Applications

Surface Mount Technology (SMT) Assembly

Precisely handles microelectronic components, ensuring genaue placement on printed circuit boards with high-speed vacuum suction and alignment control.

Semiconductor Device Packaging

Facilitates delicate handling of fragile dies and wafers, minimizing mechanical stress and electrostatic discharge during automated assembly processes.

Flexible Printed Circuit Board (FPCB) Manufacturing

Supports precise Komponente placement on flexible substrates, maintaining consistent vacuum force without damaging flexible or thin film materials.

Automotive Electronics Assembly

Enables reliable placement of sensors, microcontrollers, and connectors on PCBs exposed to vibration and thermal cycling in automotive environments.

Medical Device Manufacturing

Ensures contamination-free and exact Komponente positioning in assembly of compact, sensitive medical electronics and implantable devices.

Aerospace Electronics Production

Handles miniature high-reliability components in harsh environmental tolerance assemblies, maintaining positional accuracy during complex multi-layer board fabrication.

Adaptive Fit for Multi-Vendor Head Platforms

Pick-and-Place Head Nozzles must interface precisely with various OEM systems such as Fuji, Panasonic, ASM, and Yamaha. Mismatched tolerances can cause seating issues or misalignment during head rotation. Each Pick-and-Place Head Nozzle is manufactured to match OEM collar dimensions, vacuum offsets, and drive features. Compatibility is validated through kinematic fixture tests and vacuum seal checks in both metric and imperial formats.

Pick-and-Place Head Nozzles require consistent optical geometry to support high-resolution vision alignment. Irregular surfaces or tip asymmetry can interfere with fiducial detection and centroid correction. Each Pick-and-Place Head Nozzle features low-reflectivity coatings and symmetric tip profiles, with dimensional variation controlled within ±5 µm to ensure accurate vision-based calibration during high-speed operation.

Having Doubts? Our FAQ

Check all our Frequently Asked Question

How does Frigate ensure vacuum stability in their Pick-and-Place Head Nozzles under high acceleration?

Fregatte designs nozzle orifices with CFD-optimized internal flow channels to minimize turbulence and maintain laminar vacuum flow. This reduces pressure fluctuations during rapid X-Y movements. The nozzles undergo dynamic leak-down testing to verify vacuum retention under acceleration forces exceeding 1g. These controls ensure stable component pickup without loss during fast head transitions.

What manufacturing controls does Frigate apply to maintain dimensional precision in their Pick-and-Place Head Nozzles?

Frigate uses multi-axis CNC machining combined with in-process probing for real-time dimensional control. Post-process inspection employs optical coordinate measuring machines with ±2 µm accuracy. Thermal stability tests confirm nozzle concentricity holds after extended operation at elevated temperatures. This guarantees consistent placement accuracy throughout production cycles.

How does Frigate address nozzle tip wear to extend tool life in demanding SMT environments?

Frigate selects DLC coatings and high-hardness ceramic materials for nozzle tips to resist abrasion and chemical degradation. These materials pflegen edge sharpness and vacuum grip despite exposure to flux and solder paste residues. Accelerated cycle testing simulates millions of placements to verify wear resistance. This approach reduces nozzle replacement frequency and line downtime.

What ESD mitigation strategies are integrated into Frigate’s Pick-and-Place Head Nozzles?

Frigate incorporates conductive polymers and surface resistive coatings that comply with IEC 61340-5-1 standards for static discharge. The coatings ensure rapid charge dissipation, reducing the risk of voltage spikes during part pickup. Electrical continuity is maintained without compromising vacuum performance. This protects sensitive semiconductor devices during high-speed placement.

How does Frigate verify compatibility of their Pick-and-Place Head Nozzles with multiple OEM machine platforms?

Frigate manufactures nozzles to match exact collar and vacuum port dimensions of leading OEMs like Fuji, ASM, Panasonic, and Yamaha. Each nozzle undergoes kinematic fixture testing to confirm proper seating and rotational indexing. Vacuum seal integrity is verified for both metric and imperial specifications. This process ensures seamless mechanical and pneumatic integration across platforms.

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